• MataVatnik@lemmy.world
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      11 months ago

      My only surprise here is the turn around. According to the people I listened to China was nowhere near the 7nm range, at all. Sanctions were put place no less than half a year ago, so for them to have figured it out this quickly is what’s making it look sus. It takes nations years if not decades to get to thus point, and countries have failed trying too. My money is they are using western manufactured lithography equipment.

      Edit: From the South China article:

      TechInsights said SMIC used existing equipment and its second-generation 7-nm process to manufacture the 5G-capable Kirin 9000s for Huawei

      Huawei was known to have been stockpiling chips from its HiSilicon unit before TSMC cut ties to comply with US sanctions

      • Meowoem@sh.itjust.works
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        11 months ago

        Doesn’t it make you think those people were probably wrong? Far too many people base statements like that on assumption. From the article I read they’re using a different method to fabricate them and they’re very different to other chips on the market - china have a huge engineering sector and have been investing heavily in chip r&d for a long time.

        • MataVatnik@lemmy.world
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          11 months ago

          I doubt it. Ten years ago when I was in college I attended a presentation of a researcher who was working on lithography methods at the 9nm scale and the challenges that came with it. A country doesn’t go from making 40nm chips to making 7nm chips in less than a year. It’s simply not possible. If it was that simple Taiwan wouldn’t be geopolitically important, where all of the silicone fabs capable of <7nm are located and how they supply literally all of the world because no one else can. India tried started an industry and failed. The US is now spending billions of dollars to open up fabs in the US and its going to take them way more than a year or two.

          It’s like the development of the hypersonic missile, you simply cannot develop it overnight. So when China or Russia says they have it I’m skeptical, and with Russia it turned out that they really didn’t have a true hypersonic missile as was shown in Ukraine.

          As I understand it, the sanctions against China were not against the chips, but the manufacturing equipment for making the chips which China does not know how to make and its the part of the intellectual property that the US controls. Like I said, I think they circumnavigated sanctions to get this equipment, and probably got some workers who knew how to work them. That is if the headline is true.

      • StugStig@lemmygrad.ml
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        11 months ago

        China prepared for this 17 years ago. They launched the “02 Special Project” all the way back in 2006. The companies established by those grants have existed years before the sanctions. They were able to develop the products but selling them was another thing entirely, until the sanctions hit causing a massive boom in their revenue. People forget that it was market conditions that killed GlobalFoundries 7nm effort not technical issues. The same reason UMC gave up on anything more advanced than 14nm. Sanctions created the inevitability of Chinese 7nm by wedding the world’s largest telecom equipment vendor, Huawei to SMIC.

        It’s an amusing coincidence that by the time ASML will no longer be granted export licenses for their 5nm capable DUV scanners, the NXT:2000i and above, SMEE will be selling a 7nm capable scanner, the SSA/800-10W. A machine easily comparable to the NXT:1980Di that TSMC used to develop their N7 process. The fact that the NXT:1980Di and anything less advanced than it isn’t going to be export restricted is an implicit acknowledgement of the Chinese capability of making competing machines.

        5nm capable DUV scanners, such as the SSA/900 still in development, might be a requirement for SMIC N+2 however as the “7nm” Kirin 9000S is only 2% larger than the TSMC N5 made Kirin 9000. That suggest a density far exceeding anything any other foundry has been capable of with just DUV, such as Intel 7 or TSMC N7/N7P.

        Applied Materials and LAM are less of an issue. AMEC has been selling 5nm etching systems to Samsung and TSMC for years.

        TSMC made Kirin 9000 ran out in 2021, P50 Pro was the last phone to use it and the Kirin 820 ran out in 2022. It’s only the 5G base stations that still use TSMC made HiSilicon chips.